W. Rhett Davis

North Carolina State University — United States

Engineering · Physical Sciences

20h-index2.9kcitations167works0.52yr avg
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Research Topics

3D IC and TSV technologies(40), Cosmology and Gravitation Theories(31), Semiconductor materials and devices(27), Interconnection Networks and Systems(21), Black Holes and Theoretical Physics(20)

Publications166 total

Privacy-Preserving Data and Model Sharing for EDA via Inference Control and DP-SGD
2025
DE-HNN: An effective neural model for Circuit Netlist representation
arXiv (Cornell University)·2024· 1 citedOpen Access
A Deep Transfer Learning Design Rule Checker With Synthetic Training
IEEE Design and Test·2022· 4 cited
Fast and Accurate PPA Modeling with Transfer Learning
2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD)·2021· 7 cited
A Virtual Platform for Object Detection Systems
2021
Fast and Accurate PPA Modeling with Transfer Learning
2021· 2 cited
An Instruction-Level Power and Energy Model for the Rocket Chip Generator
2021· 2 cited
Design Rule Checking with a CNN Based Feature Extractor
arXiv (Cornell University)·2020Open Access
Design Rule Checking with a CNN Based Feature Extractor
2020· 9 cited
Development of a Predictive Process Design kit for15-nm FinFETs: FreePDK15
arXiv (Cornell University)·2020· 2 citedOpen Access
How to write a compact reliability model with the Open Model Interface (OMI)
2020· 9 cited
Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages
2019· 2 cited
Estimating Pareto Optimum Fronts to Determine Knob Settings in Electronic Design Automation Tools
2019
Characterization of Fast, Accurate Leakage Power Models for IEEE P2416
2019· 2 cited
3-D-DATE: A Circuit-Level Three-Dimensional DRAM Area, Timing, and Energy Model
IEEE Transactions on Circuits and Systems I Regular Papers·2018· 15 cited
Electrothermal Simulation of Three-Dimensional Integrated Circuits
2018
H3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor
2017· 6 cited
Physical design of a 3D-stacked heterogeneous multi-core processor
2016· 4 cited
Novel packaging and thermal measurement for 3D heterogeneous stacks
2016
Thermal raman and IR measurement of heterogeneous integration stacks
2016· 3 cited
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Frequent Co-authors

Paul D. Franzon(14), Samson Melamed(10), M.B. Steer(6), Ravi Jenkal(6), Christopher Mineo(5), Ambarish Mukund Sule(5), Borivoje Nikolić(5), L. K. Norris(5), D. R. Oliver(4), Shivam Priyadarshi(4), M. K. Moss(4), Hua Hao(3), Gerald H. Katzin(3), E. Yeo(3), S. Augsburger(3), R.W. Brodersen(3), T. Robert Harris(3), Thor Thorolfsson(3), Julie Oh(2), Jack Levine(2)