Toranosuke Ashizawa

Hitachi (Japan) — Japan

Engineering · Physical Sciences

8h-index172citations18works0.02yr avg
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Research Topics

Advanced Surface Polishing Techniques(14), Advanced machining processes and optimization(6), Physics of Superconductivity and Magnetism(4), Diamond and Carbon-based Materials Research(4), Copper Interconnects and Reliability(4)

Publications18 total

Effect of pad groove width on slurry mean residence time and slurry utilization efficiency in CMP
Microelectronic Engineering·2016· 35 cited
Effect of pad surface micro-texture on dishing and erosion during shallow trench isolation chemical mechanical planarization
Japanese Journal of Applied Physics·2014· 16 cited
Effect of Pad Surface Micro-Texture on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization Process
Japanese Journal of Applied Physics·2012· 18 cited
Chemical Mechanical Polishing with Nanocolloidal Ceria Slurry for Low-Damage Planarization of Dielectric Films
Japanese Journal of Applied Physics·2012· 1 cited
Chemical Mechanical Polishing with Nanocolloidal Ceria Slurry for Low-Damage Planarization of Dielectric Films
Japanese Journal of Applied Physics·2012· 5 cited
Applications of Shear Force Spectral Analysis in STI CMP
2011
Pattern evolution in shallow trench isolation chemical mechanical planarization via real-time shear and down forces spectral analyses
Microelectronic Engineering·2011· 16 cited
Effect of Pad Surface Micro-Texture on Coefficient of Friction and Removal Rate during Copper CMP Process
Electrochemical and Solid-State Letters·2011· 17 cited
Effect of Pad Micro-Texture on Frictional Force, Removal Rate, and Wafer Topography during Copper CMP Process
ECS Transactions·2010· 5 cited
Effect of Cerium Oxide Particle Sizes in Oxide Chemical Mechanical Planarization
Electrochemical and Solid-State Letters·2009· 23 cited
Pattern evolution studies in STI CMP via real-time shear and down force spectral analyses
2008
A New Cerium-Based Ternary Oxide Slurry, CeTi<sub>2</sub>O<sub>6</sub>, for Chemical-Mechanical Polishing
Japanese Journal of Applied Physics·2007· 16 cited
Scratch-free dielectric CMP slurry with 5-nm colloidal ceria abrasive
Symposium on VLSI Technology·2006
Effect of Pad Surface Roughness on SiO<sub>2</sub> Removal Rate in Chemical Mechanical Polishing with Ceria Slurry
Japanese Journal of Applied Physics·2006· 10 cited
Magnetic Shielding Performance and Flux Creep in Bi-2212 Cylinders
1997· 1 cited
Formation of 2223 Phase and Variation in Composition of Bi(Pb)-Sr-Ca-Cu-O Superconductors
1990
Variation of Composition in a Bi(Pb)-Sr-Ca-Cu-O Grain and the Influence of Mg and Ba Doping on Its Superconductivity
Japanese Journal of Applied Physics·1989· 7 cited
Superconducting Properties of Y-Ba-Cu-O Sheet by a Tape Casting Method
1989· 2 cited

Frequent Co-authors

Ara Philipossian(9), Yun Zhuang(6), Yasa Sampurno(5), Fransisca Sudargho(4), Xiaoyan Liao(4), L. Borucki(4), Siannie Theng(4), Naoyuki Koyama(4), Shuichiro Shimoda(4), Xiaomin Wei(3), Hiroyuki Morishima(3), Yong Zhuang(3), Shōzō Yamana(3), K. Sumiya(3), Hideji Kuwajima(3), Daisuke Ryuzaki(3), Yoichi Machii(3), Haruaki Sakurai(3), Jiang Cheng(2), Masato Yoshida(2)