Je-Young Chang

Intel (United States) — United States

Engineering · Physical Sciences

9h-index664citations34works47.32yr avg
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Research Topics

Heat Transfer and Optimization(24), Heat Transfer and Boiling Studies(20), Thermal properties of materials(5), Refrigeration and Air Conditioning Technologies(5), Heat Transfer Mechanisms(4)

Publications34 total

Reliability Risk Assessment of Server CPU Package in Single Phase Hydrocarbon-Based Immersion Fluid
IEEE Transactions on Components Packaging and Manufacturing Technology·2025
Spatial Variation of Thermal Properties in Thermal Interface Materials Using a Frequency Domain Thermoreflectance Method
SSRN Electronic Journal·2025Open Access
Liquid cooling of data centers: A necessity facing challenges
Applied Thermal Engineering·2024· 142 citedOpen Access
Spatial Thermal Conductivity Variation of Particulate-Filled Thermal Interface Materials
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)·2022· 3 cited
Non-Destructive Evaluation of Thermal Interface Materials using Modulated Heating of Selective Cores
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)·2022
Performances of Two-Phase Cooling Technologies that Uses Water as Working Fluid under Sub-Ambient Pressures
2021· 5 cited
Package-Level Integration of Liquid Cooling Technology with Microchannel IHS for High Power Cooling
2021· 3 cited
(Invited) Assessing Corrosion Risk of Cu Heat-Exchanger Assembled with Cu-P Brazing Alloys
ECS Meeting Abstracts·2020
Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 2: Corrosion Reliability Testing and Failure Model
2020· 6 cited
Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 1: Flow Loop Design for Reliability Tests
2020· 3 cited
Study of Corrosion Mechanism in Brazed Cu Joints
ECS Meeting Abstracts·2020
Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms
Journal of Electronic Packaging·2019· 3 citedOpen Access
Phase Change Material Compact Model: Validation and Sensitivity as Thermal Interface Material
2018
EDAPS 2018 Author Index
2018Open Access
Thermal Management of Electronics Using Sprays and Droplets
Energy, environment, and sustainability·2017· 2 cited
Corrosion in a closed-loop electronic device cooling system with water as coolant and its detection
2017· 8 cited
Thermal-mechanical considerations during thermal solution assembly of bare-die packages
2016· 1 cited
Compact Thermal Modeling Methodology for Active and Thermal Bumps in 3D Microelectronic Packages
2015· 7 cited
DEVELOPMENT OF ALUMINUM-WATER HEAT PIPES
Heat Pipe Science and Technology An International Journal·2014· 2 cited
Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling
2010· 4 cited
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Frequent Co-authors

Ravi Prasher(14), Suzana Prstic(10), John Dirner(8), Choong-Un Kim(6), David Chau(5), Dongming He(5), Tao Tong(5), Alan Myers(4), Geng Ni(3), Michael Jorgensen(3), Zechen Zhang(3), Piyush Kulkarni(3), Bahgat Sammakia(3), Scott N. Schiffres(3), Shankar Devasenathipathy(3), Joungho Kim(3), Tiejun Zhang(2), Yoav Peles(2), John T. Wen(2), Michael K. Jensen(2)