John Dirner

Intel (United States) — United States

Engineering · Physical Sciences

4h-index206citations9works0.02yr avg
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Research Topics

Heat Transfer and Boiling Studies(8), Heat Transfer and Optimization(8), Heat Transfer Mechanisms(2), Parallel Computing and Optimization Techniques(1), Electronic Packaging and Soldering Technologies(1)

Publications9 total

High-Speed Visualization of Phase-Change Processes in Silicon Microchannels With Water and HFE-7100 as Working Fluids
2007
Performances of Silicon Micro-Flow-Passage Cold Plates From Single-Phase to Two-Phase With Water and HFE-7100 as Working Fluids
2007
Evaluation of solid-state temperature control of silicon packages
2006
Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micropin-Fins Under Cross Flow for Water as Fluid
Journal of Heat Transfer·2006· 158 cited
Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micro-Pin-Fins Under Cross Flow for Water as Fluid
2006· 18 cited
Performance of Two-Phase Microchannels at Sub-Atmospheric Pressure
2006
Convective Performance of Package Based Single Phase Microchannel Heat Exchanger
2005· 19 cited
Effect of Localized Hotspot on the Thermal Performance of Two-Phase Microchannel Heat Exchanger
2005· 9 cited
Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow
2005· 2 cited

Frequent Co-authors

Suzana Prstic(9), Ravi Prasher(8), Je-Young Chang(8), David Chau(5), Dongming He(5), Alan Myers(4), Tao Tong(3), Shankar Devasenathipathy(3), Alan Myers(1), Cristina Silvia Polo López(1), S. Cass(1)