David Chau

Engineering · Physical Sciences

10h-index600citations30works0.02yr avg
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Research Topics

Heat Transfer and Optimization(12), Heat Transfer and Boiling Studies(8), Electronic Packaging and Soldering Technologies(5), 3D IC and TSV technologies(5), Adsorption and Cooling Systems(5)

Publications30 total

Fabric and garment drape
Elsevier eBooks·2009· 7 cited
Development of Flip Chip Die Bump Temperature Measurement Methodology Using a Computational Fluid Dynamics (CFD) Tool
2006· 1 cited
Thin film thermoelectric cooler thermal validation and product thermal performance estimation
2006· 6 cited
Feasibility study of using solid state refrigeration technologies for electronic cooling
2006· 9 cited
High-Density Compliant Die-Package Interconnects
2006· 19 cited
Use-condition thermal metrics for characterization of thin film TEC modules on electronic packages
2006· 3 cited
Experimental and Numberical Method of Measuring Flip Chip Die Bump Temperature for Electroncis Packing
2006· 1 cited
Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micropin-Fins Under Cross Flow for Water as Fluid
Journal of Heat Transfer·2006· 158 cited
Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micro-Pin-Fins Under Cross Flow for Water as Fluid
2006· 18 cited
Impact of different flip-chip bump materials on bump temperature rise and package reliability
2005· 6 cited
Convective Performance of Package Based Single Phase Microchannel Heat Exchanger
2005· 19 cited
Effect of Localized Hotspot on the Thermal Performance of Two-Phase Microchannel Heat Exchanger
2005· 9 cited
Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow
2005· 2 cited
Experimental method of measuring C4 die bump temperature for electronics packaging
2004· 7 cited
Investigation of electrostrictive polymers as actuators for mesoscale devices
The International Journal of Advanced Manufacturing Technology·2004· 25 cited
Microchannel Experimental Structure for Measuring Temperature Fields During Convective Boiling
2004· 5 cited
Energy conservation in compressed-air systems
International Journal of Energy Research·2002· 101 cited
Experimental Results on the Application of a High-Voltage Capacitance-Based Technology to Reduce Biofouling in Reverse Osmosis Systems
2001
Economic feasibility of combined heat and power and absorption refrigeration with commercially available gas turbines
Energy Conversion and Management·2001· 72 cited
Experimental results for a hydraulic refrigeration system using n-butane
International Journal of Refrigeration·2001· 5 cited
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Frequent Co-authors

Patrick E. Phelan(8), Byard D. Wood(8), Suzana Prstic(7), Ravi Prasher(6), John Dirner(5), Je-Young Chang(5), Dongming He(5), Alan Myers(4), N. S. Berman(4), Sridhar Narasimhan(4), W. Rice(3), G. Chrysler(3), Deepak Ganapathy(3), Kelly Lofgreen(3), Chia‐Pin Chiu(3), Ashish Gupta(3), K. Kim(3), Ruben J. Trujillo(2), Jian Mou(2), Neil S. Berman(2)