Muhammad Zeshan Ali

Universiti Sains Malaysia — Malaysia

Engineering · Physical Sciences

11h-index332citations27works0.02yr avg
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Research Topics

Semiconductor materials and devices(7), Conducting polymers and applications(7), Copper Interconnects and Reliability(7), Advanced Sensor and Energy Harvesting Materials(6), Electronic Packaging and Soldering Technologies(6)

Publications27 total

Thermal activation vs. Joules heating in hybrid fiber-reinforced shape memory polymer composites
Materials Letters·2025
Enhanced InGaAs/AlAs RTD quantum device with frequency multiplier application
International Journal of Nanoelectronics and Materials (IJNeaM)·2025Open Access
Identifying Modulators of the Post-Antibiotic Effect
2025Open Access
Comprehensive Principles of Medical and Applied Physics: Bridging Science with Technology
Bright Sky Publications eBooks·2024Open Access
Polymers in optoelectronic devices
Elsevier eBooks·2023· 1 cited
Electronic packaging and thermal management
Elsevier eBooks·2023· 4 cited
Optoelectronic properties of polymers
Elsevier eBooks·2023· 1 cited
Basic electronic
Elsevier eBooks·2023
Introduction to polymers
Elsevier eBooks·2023· 7 cited
Conductive polymer
Elsevier eBooks·2023
Single-step treatment to improve conductivity of PEDOT:PSS by hydrobromic acid solution for application of transparent electrode
Organic Electronics·2022· 14 cited
Tunneling Percolation Mechanism of Conductivity for PEDOT:PSS in Hydrophilic PDMS Composite for the Fabrication of Highly Sensitive Strain Sensors
Macromolecular Chemistry and Physics·2022· 11 cited
Simultaneous enhancement of conductivity and Seebeck coefficient of PEDOT:PSS by triflic acid treatment for flexible thermoelectric generator
Synthetic Metals·2022· 31 cited
Bending analysis of polydimethylsiloxane composite substrate patch antenna for 5G application
AIP conference proceedings·2021· 3 cited
Stretch analysis of polydimethylsiloxane composite microstrip patch antenna for 5G application
AIP conference proceedings·2021· 3 cited
Alignment of silver nanoparticles in polysiloxane crosslink network under direct electric field
Composites Science and Technology·2020· 25 cited
Effect of Alumina Nanofiller on the Mechanical Properties of 2D Woven Biotex Flax/PLA Fiber-Reinforced Nanocomposite
Lecture notes in mechanical engineering·2020· 13 cited
Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
2019· 6 cited
Mechanisms of Electromigration Damage in Cu Interconnects
2018· 26 cited
Fully Aligned Via Integration for beyond 7 nm
Extended Abstracts of the 2018 International Conference on Solid State Devices and Materials·2018
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Frequent Co-authors

Mohamad Adzhar Md Zawawi(10), G. Lian(9), Huai Huang(6), H. Shobha(6), R. Patlolla(6), Zulkifli Ahmad(6), J. Demarest(5), Griselda Bonilla(5), Muhammad Khalil Abdullah(5), Chunhua Hu(4), Zulkifli Ahmad(4), P. McLaughlin(4), S. Nguyen(4), Devika Sil(4), Nicholas A. Lanzillo(4), James J. Kelly(3), K. Motoyama(3), Y. Ostrovski(3), T. Spooner(3), L. Gignac(3)