Y. Ostrovski

Materials Science · Physical Sciences

8h-index251citations10works0.02yr avg
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Research Topics

Copper Interconnects and Reliability(8), Semiconductor materials and devices(7), Advanced ceramic materials synthesis(3), Electronic Packaging and Soldering Technologies(3), Surface Modification and Superhydrophobicity(2)

Publications10 total

Mechanisms of Electromigration Damage in Cu Interconnects
2018· 26 cited
Future on-chip interconnect metallization and electromigration
2018· 69 cited
Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires
2017· 43 cited
Modeling and simulation of particles in gas–liquid interface
Advanced Powder Technology·2015· 9 cited
Modeling and Simulation of Mono-Layer Coating
Drying Technology·2015· 7 cited
Effect of low-frequency radio frequency on plasma-enhanced chemical vapor deposited ultra low-κ dielectric films for very large-scale integrated interconnects
Journal of Applied Physics·2014· 14 cited
Effects of chemical mechanical polishing on a porous SiCOH dielectric
Microelectronic Engineering·2011· 11 cited
Effective Cu surface pre-treatment for high-reliable 22nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k=2.2)
Microelectronic Engineering·2011· 13 cited
Property modifications of nanoporous pSiCOH dielectrics to enhance resistance to plasma-induced damage
Journal of Applied Physics·2008· 53 cited
Development and optimization of porous pSiCOH interconnect dielectrics for 45 nm and beyond
2008· 6 cited

Frequent Co-authors

Chunhua Hu(4), H. Shobha(3), T. Spooner(3), L. Gignac(3), Chris Breslin(3), G. Lian(3), Muhammad Zeshan Ali(3), E. Todd Ryan(3), A. Grill(3), James J. Kelly(2), Huai Huang(2), K. Motoyama(2), J. H-C Chen(2), R. Patlolla(2), B. Peethala(2), Praneet Adusumilli(2), J. Benedict(2), V. Kamineni(2), Xingxing Zhang(2), Frank W. Mont(2)