S. Filipiak

ON Semiconductor (United States) — United States

Engineering · Physical Sciences

7h-index200citations22works0.02yr avg
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Research Topics

Semiconductor materials and devices(14), Copper Interconnects and Reliability(12), Advancements in Semiconductor Devices and Circuit Design(8), Integrated Circuits and Semiconductor Failure Analysis(5), Electronic Packaging and Soldering Technologies(3)

Publications22 total

Strain-Enhanced CMOS Through Novel Process-Substrate Stress Hybridization of Super-Critically Thick Strained Silicon Directly on Insulator (SC-SSOI)
2006· 13 cited
The Effects Of Passivation And Post Passivation Anneal On The Integrity Of Thin Gate Oxides
2005· 5 cited
A novel contact hole shrink process for the 65-nm-node and beyond
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2005· 6 cited
Interconnect mechanical reliability with low κ dielectric as final ILD
2003· 3 cited
Integration challenges of 0.1 μm CMOS Cu/low-k interconnects
2003· 4 cited
Avoiding plasma induced damage to gate oxide with conductive top film (CTF) on PECVD contact etch stop layer
2003· 8 cited
Integration of SiCN as a low κ etch stop and Cu passivation in a high performance Cu/low κ interconnect
2003· 12 cited
Integration of multi-level copper metallization into a high performance sub-0.25 μm CMOS technology
2002
Remote microwave technology for chamber clean to reduce PFC emissions
2002
A high performance 3.97 μm/sup 2/ CMOS SRAM technology using self-aligned local interconnect and copper interconnect metallization
2002· 7 cited
A high performance 1.8 V, 0.20 μm CMOS technology with copper metallization
2002· 101 cited
Copper integration into 0.5 μm BiCMOS technology
2002
A high density 0.10 μm CMOS technology using low K dielectric and copper interconnect
2002· 15 cited
Theoretical and Experimental Analysis of the Low Dielectric Constant of Fluorinated Silica
MRS Proceedings·2000· 2 cited
Antireflective coating optimization techniques for sub-0.2-μm geometries
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·1999· 1 cited
Integration Challenges of Inorganic Low-K (K≤2.5) Materials with Cu for Sub-0.25µm Multilevel Interconnects
MRS Proceedings·1999
Theoretical and Experimental Analysis of the Low Dielectric Constant of Fluorinated Silica
MRS Proceedings·1999· 3 cited
Integration Challenges of Inorganic Low-K (K≤2.5) Materials with CU for Sub-0.25μm Multilevel Interconnects
MRS Proceedings·1999· 2 cited
Integration of Multi-Level Copper Metallization into a High Performance Sub-0.25μM Technology
MRS Proceedings·1998· 4 cited
Plasma antireflective coating optimization using enhanced reflectivity modeling
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·1997· 3 cited
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Frequent Co-authors

T. Sparks(8), P. Crabtree(7), J. Farkas(7), E. Weitzman(6), M. Herrick(5), D. Denning(5), S. Venkatesan(4), T. Lii(4), T. Stephens(4), K. Junker(4), Kai Xiang Yu(4), A. V. Gelatos(3), M. Angyal(3), C. Capasso(3), M. Freeman(3), T. Saaranen(3), C. Simpson(3), R. Venkatraman(3), D. Watts(3), T. Van Gompel(3)