Shi‐Yu Huang

Nanjing University of Finance and Economics — China

Computer Science · Physical Sciences

29h-index3.6kcitations268works2.02yr avg
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Research Topics

VLSI and Analog Circuit Testing(99), Integrated Circuits and Semiconductor Failure Analysis(65), Low-power high-performance VLSI design(49), Advancements in PLL and VCO Technologies(45), 3D IC and TSV technologies(34)

Publications268 total

Dapagliflozin alleviates sunitinib-induced cardiotoxicity through AMPKα-PPARα axis and enhances the sensitivity of renal cell carcinoma to sunitinib
BMC Medicine·2025Open Access
Green Taxation, Urban Investment Platform Debt, and Urban Green Transformation
Platforms·2025Open Access
Designing Functional Metal/Doped‐Carbon Materials via Sol–Gel Method and their Applications in Catalysis Field
The Chemical Record·2025· 1 cited
Efficient photoreduction of CO2 to complete CO catalyzed by electrospun Cu-doped In2O3 nanofibers
Sustainable materials and technologies·2025· 1 cited
SA-GCS: Semantic-Aware Gaussian Curriculum Scheduling for UAV Vision-Language Navigation
arXiv (Cornell University)·2025Open Access
Laser-Activated Multi-Physics Sensing for Structural Materials: Physics-Driven Degradation Monitoring
2025
Direct Fluorescence Anisotropy Detection of miRNA Based on Duplex-Specific Nuclease Signal Amplification
Analytical Chemistry·2025· 8 cited
Can LLM Watermarks Robustly Prevent Unauthorized Knowledge Distillation?
arXiv (Cornell University)·2025Open Access
KLF12 Aggravates Angiotensin II‐Induced Cardiac Remodeling in Male Mice by Transcriptionally Inhibiting SMAD7
Journal of the American Heart Association·2025· 2 citedOpen Access
Excellent catalytic performance toward room temperature reduction of Cr(VI) in water over Ni/N-doped carbon catalysts prepared by sol-gel method in the range of 800–1000 °C
Journal of Alloys and Compounds·2025· 4 cited
Connectivity-Agnostic Built-In Self-Repair of Interconnects in a Chiplet IC
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems·2024
Built-In Self-Repair of Small Delay Faults Occurring to TSVs in a 3D-DRAM Using an Enhanced Pulse-Vanishing Test
IEEE Transactions on Very Large Scale Integration (VLSI) Systems·2024· 2 cited
Trojan Horse Detection for RISC-V Cores Using Cross-Auditing
2024
Amorphous functional Ca-Co-O-P-C and Co3O4/P-C materials with high catalytic performances toward hydrogenation reduction and advanced oxidation of 4-nitrophenol
Journal of environmental chemical engineering·2024· 7 cited
Cooperative Control of Connected-Autonomous Electric Buses With Tradeoffs Between Energy Saving and Mobility
IEEE Transactions on Intelligent Transportation Systems·2024· 6 cited
MQE: Unleashing the Power of Interaction with Multi-agent Quadruped Environment
2024· 4 cited
Lightweighting study of key components of lifting spreader based on the ANSYS workbench
Journal of Physics Conference Series·2024Open Access
PatchBreaker: defending against adversarial attacks by cutting-inpainting patches and joint adversarial training
Applied Intelligence·2024
Resilience quantification and recovery strategy simulation for urban underground logistics systems under node and link attacks: A case study of Nanjing city
International Journal of Critical Infrastructure Protection·2024· 9 cited
Low-Jitter Frequency Doubling Circuit Supporting Higher-Speed BISG and Aging Sensing in a Chiplet-Based Design Environment
IEEE Transactions on Very Large Scale Integration (VLSI) Systems·2024
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Frequent Co-authors

Kwang‐Ting Cheng(10), Kuang-Chien Chen(8), Kun-Han Tsai(6), Wu-Tung Cheng(6), Chang‐Jiu Li(4), Guan‐Jun Yang(4), Ding-Ming Kwai(4), Yung-Fa Chou(4), Cheng‐Wen Wu(4), Bin Ding(3), Stephen Sunter(3), Yu-Hsiang Lin(3), Chao-Wen Tzeng(3), Yan Li(2), Qianqian Chu(2), Wu-chun Feng(2), Yung‐Chang Chen(2), Lili Gao(2), Lin Chen(2), Xiaolei Li(2)