J. Siegert

Luther University — South Korea

Physics and Astronomy · Physical Sciences

11h-index435citations47works2.02yr avg
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Research Topics

Semiconductor Quantum Structures and Devices(14), 3D IC and TSV technologies(13), Electronic Packaging and Soldering Technologies(9), Quantum Dots Synthesis And Properties(8), Integrated Circuits and Semiconductor Failure Analysis(8)

Publications47 total

Hydroxide Mobility in Aqueous Systems: Combining <i>Ab Initio</i> Accuracy with Millisecond Timescales
Small·2025· 4 citedOpen Access
Chemical Structure‐Dependence of the Thermal Transition in Thermoresponsive Ethylene‐Glycol‐Containing Polymers as Characterized by EPR Spectroscopy
Macromolecular Chemistry and Physics·2025Open Access
Chemical Structure‐Dependence of the Thermal Transition in Thermoresponsive Ethylene‐Glycol‐Containing Polymers as Characterized by EPR Spectroscopy
Macromolecular Chemistry and Physics·2025· 2 citedOpen Access
Chemical structure-dependence of the thermal transition in thermoresponsive ethylene-glycol-containing polymers as characterized by EPR spectroscopy
2025
High Temperature Stable Temporary Bond Adhesive for IR Laser Debonding Enables NewProcess Integration For Thin Wafers
2024· 1 cited
Fast in-line failure analysis of sub-micron-sized cracks in 3D interconnect technologies utilizing acoustic interferometry
Communications Engineering·2024· 5 citedOpen Access
An End-to-End Convolutional Neural Network for Automated Failure Localisation and Characterisation of 3D Interconnects
Research Square (Research Square)·2023· 2 citedOpen Access
Etching Mechanisms of SiO<sub>2</sub> and SiN<sub>x</sub>:H Thin Films in HF/Ethanol Vapor Phase: Toward High Selectivity Batch Release Processes
Journal of Microelectromechanical Systems·2019· 18 cited
Konzeption eines Co-Designs für kundenindividuelle Produkte*/Concept of a co-design for customized products – Design of a mockup
wt Werkstattstechnik online·2019
Metallization defect detection in 3D integrated components using scanning acoustic microscopy and acoustic simulations
Microelectronics Reliability·2018· 12 citedOpen Access
Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests
IEEE Transactions on Device and Materials Reliability·2018· 3 cited
3D Si interposer &amp; WLP for small power devices for harsh conditions
2017· 4 cited
Manufacturing and characterization of die to die interconnections for 3D applications in harsh environmental conditions
2016
Advanced Detection and Removal Method of Polymer Residues on Semiconductor Substrates
Wafer-Level Packaging Symposium·2016
3D integration for power MOS H bridge power application
2016 6th Electronic System-Integration Technology Conference (ESTC)·2016· 2 cited
Advanced detection method for polymer residues on semiconductor substrates: 3D/TSV/interposer: Through silicon via and packaging
2016
ATHENIS_3D: Automotive Tested High-voltage and Embedded Non-volatile Integrated SoC Platform with 3D Technology
2016· 11 cited
Gas Sensing Characterisation of CMOS Integrated Nanocrystalline SnO2 – Au Thin Films
Materials Today Proceedings·2015· 4 cited
Bimetallic nanoparticles for optimizing CMOS integrated SnO&lt;inf&gt;2&lt;/inf&gt; gas sensor devices
2014· 3 cited
Manufacturing of 3D integrated sensors and circuits
2014· 3 cited
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Frequent Co-authors

Franz Schrank(16), S. Marcinkevičius(11), R. León(8), Jochen Kraft(7), Stephan Steinhauer(6), J. Teva(5), Matthias Petzold(5), S. A. Chaparro(5), Giorgio C. Mutinati(5), E. Brunet(5), M. Schrems(5), C. Hartler(5), E. Wachmann(4), S. R. Johnson(4), Jean Charbonnier(4), S. Marcinkevičius(3), Cathal Cassidy(3), Bronislovas Čechavičius(3), B. Magness(3), W. A. Taylor(3)