J. M. E. Harper

Engineering · Physical Sciences

44h-index6.9kcitations182works0.02yr avg
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Research Topics

Semiconductor materials and devices(63), Copper Interconnects and Reliability(63), Semiconductor materials and interfaces(57), Metal and Thin Film Mechanics(47), Ion-surface interactions and analysis(34)

Publications182 total

The Role of Interdisciplinary Teams in LLM Projects
Productivity Press eBooks·2025
Inferring compressible fluid dynamics from vent discharges during volcanic eruption
AGUFM·2018
The propagation of GPS signals through electrically charged plumes
AGU Fall Meeting Abstracts·2017
The Effects of Ice on the Frictional Electrification of Plumes
AGU Fall Meeting Abstracts·2015
The Chthonic Charging of Volcanic Flows: The Generation of Vent Lightning
AGUFM·2015
Initial Results Utilizing a Commercially Available Ultrasonic Sensor for Forage Yield Measurement
2013 Kansas City, Missouri, July 21 - July 24, 2013·2013· 3 cited
Synergistic Ag (111) and Cu (111) texture evolution in phase-segregated Cu1−xAgx magnetron sputtered composite thin films
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films·2010· 6 cited
Dependence of fiber texture on composition in metal-insulator Au–SiO2 composite thin films
Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena·2009· 1 cited
DETERMINATION OF THE ONSET TEMPERATURES FOR THE DROP IN RESISTIVITY AND THE INCREASE IN GRAIN SIZE FOR CU ALLOY FILMS BY IN SITU SHEET RESISTANCE AND IN SITU SYNCHROTRON X-RAY DIFFRACTION MEASUREMENTS.
2009
Crystallographic texture control of sputtered HfN thin films using low oxygen partial pressures
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films·2008· 1 cited
Fiber textures of titanium nitride and hafnium nitride thin films deposited by off-normal incidence magnetron sputtering
Journal of Applied Physics·2008· 10 cited
Competitive growth mechanisms of aluminum nitride thin films deposited by off-normal reactive magnetron sputtering
Journal of Applied Physics·2008· 18 cited
Tilted fiber texture in aluminum nitride thin films
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films·2007· 17 cited
Effects of additive elements on the phase formation and morphological stability of nickel monosilicide films
Microelectronic Engineering·2006· 133 cited
On the use of alloying elements for Cu interconnect applications
Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena·2006· 119 cited
Effect of deposition angle on fiber axis tilt in sputtered aluminum nitride and pure metal films
Thin Solid Films·2006· 20 cited
Resistivity–temperature behavior of dilute Cu(Ir) and Cu(W) alloy films
Journal of materials research/Pratt's guide to venture capital sources·2005· 2 cited
Copper Interconnect: Fabrication And Reliability
2005· 6 cited
DIFFUSION IN CRYSTALLINE COMPOSITION-MODULATED FILMS
University of North Texas Digital Library (University of North Texas)·2004Open Access
Evolution of microstructure in Ti–Ta bilayer thin films on polycrystalline-Si and Si(001)
Thin Solid Films·2004
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Frequent Co-authors

C. Cabral(15), F. M. d’Heurle(10), J. J. Cuomo(8), J. J. Cuomo(5), Katayun Barmak(5), C. Lavoie(5), L. A. Clevenger(5), H. R. Kaufman(4), J. Gupta(4), H. T. G. Hentzell(4), R. J. Gambino(4), Lars Stolt(4), P. M. Fryer(3), T. H. Geballe(3), Jean Jordan‐Sweet(3), R. Mann(3), A. Charaı̈(3), D. A. Smith(3), Karen Holloway(2), C.‐K. Hu(2)