Zach Cole

Fayetteville Public Library — United States

Engineering · Physical Sciences

9h-index774citations24works2.02yr avg
OpenAlex↗Google Scholar↗Lab page↗

Accepting Students?

No reports yet. Know if this professor is taking students?

Research Topics

Silicon Carbide Semiconductor Technologies(18), Advanced DC-DC Converters(15), Electromagnetic Compatibility and Noise Suppression(9), Multilevel Inverters and Converters(7), Advanced Battery Technologies Research(4)

Publications24 total

Partial Discharge and Electrical Treeing Behavior of High-Voltage Power Module - A Review
2024· 2 cited
Short-Circuit Ruggedness and Partial Discharge Evaluation of a 3.3 kV SiC MOSFET Power Module
2022· 4 cited
Analysis of Ultrasonic Welding of Mechanically Coupled Small Area Contacts for a Silicon Carbide Power Module
IMAPSource Proceedings·2018
New SiC 1200 V Power MOSFET & Compact 3.25 mOhm, 41 mm Power Module for Industrial Applications
PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management·2018
SiC-MOSFET composite boost converter with 22 kW/L power density for electric vehicle application
2017· 31 cited
The next generation of high voltage (10 kV) silicon carbide power modules
2016· 99 cited
Verification of High Frequency SiC On-Board Vehicle Battery Charger for PHV
SAE technical papers on CD-ROM/SAE technical paper series·2016· 6 cited
高電圧(10 kV)炭化けい素電力モジュールの次世代【Powered by NICT】
IEEE Conference Proceedings·2016
A High Performance Power Package for Wide Bandgap Semiconductors Using Novel Wire Bondless Power Interconnections
IMAPSource Proceedings·2015· 2 cited
Compact, high-temperature, single-level power modules for 10 to 25 kV DC link voltages using silicon carbide power electronics
2015· 8 cited
High temperature, wide bandgap full-bridge power modules for high frequency applications
2015· 6 cited
A High Temperature, High Power Density Package for SiC and GaN Power Devices
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)·2015· 1 cited
High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications
2014· 27 cited
Event agenda
2014Open Access
The Design and Development of a 15 kV SiC Half-Bridge Multi-Chip Power Module for Medium Voltage Applications
IMAPSource Proceedings·2014· 8 cited
An integrated gate driver in 4H-SiC for power converter applications
2014· 10 cited
A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications
2014· 61 cited
A High-Density, High-Efficiency, Isolated On-Board Vehicle Battery Charger Utilizing Silicon Carbide Power Devices
IEEE Transactions on Power Electronics·2013· 418 cited
A 4H Silicon Carbide Gate Buffer for Integrated Power Systems
IEEE Transactions on Power Electronics·2013· 41 cited
High-frequency AC-DC conversion with a silicon carbide power module to achieve high-efficiency and greatly improved power density
2013· 15 cited
page 1 of 2Next →

Frequent Co-authors

Brandon Passmore(19), Ty McNutt(15), Bret Whitaker(12), Adam Barkley(8), Jennifer Stabach(8), Alexander B. Lostetter(6), S.S. Frank(5), Laura D. Marlino(5), Alex Lostetter(5), Robert Shaw(4), Ranjan Lamichhane(4), Michael D. Glover(4), K.J. Olejniczak(4), Daniel Martin(3), Dan Martin(3), Alan Mantooth(3), Matt Francis(3), Paul Shepherd(3), Sei‐Hyung Ryu(3), M.N. Ericson(3)