R.J. Havens

Engineering · Physical Sciences

19h-index1.5kcitations50works0.02yr avg
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Research Topics

Radio Frequency Integrated Circuit Design(28), Advancements in Semiconductor Devices and Circuit Design(24), Semiconductor materials and devices(21), Electrostatic Discharge in Electronics(9), Silicon Carbide Semiconductor Technologies(8)

Publications50 total

Physically Based Analytical Modeling of
2015
Hermeticity testing of capacitive RF MEMS switches
2008· 6 cited
Corrections on "Low-Loss Patterned Ground Shield Interconnect Transmission Lines in Advanced IC Processes"
IEEE Transactions on Microwave Theory and Techniques·2007
Low-Loss Patterned Ground Shield Interconnect Transmission Lines in Advanced IC Processes
IEEE Transactions on Microwave Theory and Techniques·2007· 51 cited
16-26GHz Low Noise Amplifier for short-range automotive radar in a production SiGe:C technology
2007· 8 cited
RF Characterisation and Process Control for Passive Integration Components
2007· 3 cited
Physics-based wideband predictive compact model for inductors with high amounts of dummy metal fill
IEEE Transactions on Microwave Theory and Techniques·2006· 32 cited
Application of the 1-D silicon limit to varactors
IEEE Transactions on Electron Devices·2006· 5 cited
Improved Y-factor method for wide-band on-wafer noise-parameter measurements
IEEE Transactions on Microwave Theory and Techniques·2005· 61 cited
Record RF performance of standard 90 nm CMOS technology
2005· 43 citedOpen Access
New low-cost thermally stable process to reduce silicon substrate losses: a way to extreme frequencies for high volume Si technologies
2005· 5 cited
Physically based analytical modeling of base-collector charge, capacitance and transit time of III-V HBT's
2005· 4 cited
Comparison of the "pad-open-short" and "open-short-load" deembedding techniques for accurate on-wafer RF characterization of high-quality passives
IEEE Transactions on Microwave Theory and Techniques·2005· 122 cited
Q enhancement with cross-connected coplanar waveguides in thick dual damascene Cu
IEEE MTT-S International Microwave Symposium Digest, 2005.·2005· 1 cited
"on-glass" process option for BiCMOS technology
2004· 2 cited
The Impact of an Aluminum Top Layer on Inductors Integrated in an Advanced CMOS Copper Backend
IEEE Electron Device Letters·2004· 7 cited
RF-performance of thick damascene Cu interconnect on silicon
2004· 3 cited
Test Structure Design Considerations for RF-CV Measurements on Leaky Dielectrics
IEEE Transactions on Semiconductor Manufacturing·2004· 21 cited
The effect of copper design rules on inductor performance
2004· 13 cited
Predictive spiral inductor compact model for frequency and time domain
2004· 37 cited
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Frequent Co-authors

L.F. Tiemeijer(32), A.J. Scholten(18), R. van Langevelde(13), D.B.M. Klaassen(12), J.C.J. Paasschens(10), R. de Kort(8), V. C. Venezia(5), Y. Bouttement(5), P. Deixler(5), W.J. Kloosterman(5), C. Detcheverry(5), A.T.A. Zegers-van Duijnhoven(4), P.H. Woerlee(4), Jurriaan Schmitz(4), F.N. Cubaynes(4), Ramses van der Toorn(4), W.D. van Noort(4), P.H.L. Bancken(3), R. Daamen(3), A.B.M. Jansman(2)