J. M. Roberts

Intel (United States) — United States

Engineering · Physical Sciences

18h-index1.1kcitations124works25.72yr avg
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Research Topics

Advancements in Photolithography Techniques(32), Integrated Circuits and Semiconductor Failure Analysis(24), Electron and X-Ray Spectroscopy Techniques(15), Microstructure and mechanical properties(13), Advancements in Semiconductor Devices and Circuit Design(12)

Publications123 total

Operating two exchange-only qubits in parallel
Nature·2025Open Access
Critical scaling of thin-film YBaCuO and NdCeCuO resistivity- current isotherms : implications for vortex phase transitions and universality
Arabixiv (OSF Preprints)·2025Open Access
12-Spin-Qubit Arrays Fabricated on a 300 mm Semiconductor Manufacturing Line
Nano Letters·2024· 33 citedOpen Access
12-spin-qubit arrays fabricated on a 300 mm semiconductor manufacturing line
arXiv (Cornell University)·2024Open Access
A Scalable mK Cryo-CMOS Demultiplexer Chip for Voltage Biasing and High-Speed Control of Silicon Qubit Gates
2024· 8 cited
Probing single electrons across 300-mm spin qubit wafers
Nature·2024· 113 citedOpen Access
Probing single electrons across 300 mm spin qubit wafers
arXiv (Cornell University)·2023· 6 citedOpen Access
Mitigating Impact of Defects On Performance with Classical Device Engineering of Scaled Si/SiGe Qubit Arrays
2022 International Electron Devices Meeting (IEDM)·2022· 2 cited
High Volume Cryogenic Characterization of Silicon Spin Qubit Devices from a 300mm Process Line
2022
Toward scalable spin qubits: Si/SiGe quantum dot devices built on a 300mm process line
Bulletin of the American Physical Society·2021
All Optical 300mm process line for spin qubit devices
Bulletin of the American Physical Society·2021
Author Correction: Noninvasive sub-organ ultrasound stimulation for targeted neuromodulation
Nature Communications·2020· 3 citedOpen Access
State-of-the-art Quantum Dot devices from a full 300mm process line: towards scalable spin qubit devices
Bulletin of the American Physical Society·2020
Intel Superconducting Qubits, Part 1: Performance improvements towards enabling quantum applications
Bulletin of the American Physical Society·2019
Intel Superconducting Qubits, Part 2: Integration on through-silicon-via (TSV) substrates.
Bulletin of the American Physical Society·2019
Full 300mm fin based QD device characterization
Bulletin of the American Physical Society·2019
Wafer-scale silicon for quantum computing
arXiv (Cornell University)·2018Open Access
Flip Chip Packaging for Superconducting Quantum Computers
Bulletin of the American Physical Society·2018
Die Design and Fabrication for Flip-Chip-Packaged Superconducting Quantum Processors
Bulletin of the American Physical Society·2018· 1 cited
Temperature Dependence of Spin Relaxation and Charge Noise in Silicon Spin Qubits
Bulletin of the American Physical Society·2018
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Frequent Co-authors

Wang Yueh(15), Kenneth E. Gonsalves(10), Cheng-Tsung Lee(9), Clifford L. Henderson(9), Theodore H. Fedynyshyn(8), Bryan J. Rice(7), David K. Astolfi(7), Manish Chandhok(6), Mingxing Wang(5), Heidi B. Cao(5), Alberto Cabral(5), Stefano Pellerano(4), K. Saláma(4), Mingxing Wang(4), Robert Bristol(4), Samuel F. Neyens(3), Otto Zietz(3), Thomas F. Watson(3), Florian Luthi(3), Aditi Nethwewala(3)